Journal of Welding Science

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Vojdanpak M K, Azadi Renani M J, Niroumand B, Maleki A. Development and characterization of lead-free Sn-Zn solder produced by angular accumulative extrusion as an alternative to commercial Sn-Pb solder. JWSTI 2025; 11 (1) :71-80
URL: http://jwsti.iut.ac.ir/article-1-486-en.html

Eutectic tin-zinc solder can be a suitable replacement for tin-lead solder due to its low cost, suitable melting temperature, and desirable mechanical properties. However, due to the high vapor pressure of zinc, manufacturing this alloy using the melt method is very difficult and expensive. In this study, Sn-8.9%Zn lead-free solder was fabricated using the angular accumulative extrusion method of tin sheets and zinc powder in 10, 12, and 15 passes, and characterized. Microstructural investigations were performed using optical and scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray diffraction spectroscopy. The shear strength and hardness of the solders were also measured. The results showed that after 12 passes, the dispersion of zinc powder in the tin matrix was improved, and the dissolution of zinc was confirmed by a decrease in the XRD peak intensities. However, after 15 passes, cracks appeared in the structure. The shear strength of the tin-zinc solder joint was about 60% higher than that of commercial tin-lead solder. The wetting angle of this solder on copper was measured to be 21 degrees, and its electrical resistance was measured to be 4.1 nanoohms, which is within the acceptable range for electronic applications, although it has a weaker performance compared to tin-lead solder.