Volume 10, Issue 1 (Journal OF Welding Science and Technology 2024)                   JWSTI 2024, 10(1): 99-108 | Back to browse issues page


XML Persian Abstract Print


Download citation:
BibTeX | RIS | EndNote | Medlars | ProCite | Reference Manager | RefWorks
Send citation to:

Nourmohammadi M H, Movahedi M, Kokabi A H. Investigating the electromigration resistance of composite lead-free solder alloy containing cobalt particles. JWSTI 2024; 10 (1) :99-108
URL: http://jwsti.iut.ac.ir/article-1-462-en.html
1- Faculty of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran.
2- Faculty of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran. , m_movahedi@sharif.edu
Abstract:   (1058 Views)
In today's technological landscape, the push for miniaturization in electronic devices is greater than ever, driven by technological advancements.The challenges of electromigration and thermomigration
have arisen due to the need to establish new electronic connections under conditions characterized by creeping temperatures, originating from the low melting point of solders and high current density.  Therefore, recently, alloying and composite materials have been employed to enhance the resistance of electronic connections to electromigration. In this study, efforts to enhance the resistance to electromigration using a composite SAC0307 lead-free solder alloy incorporating cobalt microparticles. The presence of cobalt in the intermetallic composition of the interface causes more stability of the intermetallic composition of the interface and prevents the reduction of the thickness of the intermetallic composition of the interface during the time of the electromigration test; As a result, the stability and electronic connection of the sample soldered with composite solder alloy is more than that of non-composite solder alloy. On the other hand, due to the fine grain structure and the increase in grain boundary density in the composite solder alloy, the lattice diffusion mechanism in the non-composite solder alloy has been changed to the grain boundary diffusion mechanism; As a result, due to the consumption of copper atoms flowed from the cathode side to the anode by the intermetallic compounds present in the grain boundaries, non-uniform microstructural was observed in the composite solder alloy during the time of electromigration test.
Full-Text [PDF 2703 kb]   (249 Downloads)    
Type of Study: Research | Subject: Special

Add your comments about this article : Your username or Email:
CAPTCHA

Send email to the article author


Rights and permissions
Creative Commons License This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

© 2024 CC BY-NC 4.0 | Journal of Welding Science and Technology of Iran

Designed & Developed by : Yektaweb