Volume 10, Issue 2 (Journal OF Welding Science and Technology 2024)
JWSTI 2024, 10(2): 1-12 |
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Nourmohammadi M H, Movahedi M, Kokabi A H. Development of lead-free soft solder alloy via accumulative roll bonding. JWSTI 2024; 10 (2) :1-12
URL: http://jwsti.iut.ac.ir/article-1-461-en.html
URL: http://jwsti.iut.ac.ir/article-1-461-en.html
1- Faculty of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran.
2- Faculty of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran. ,m_movahedi@sharif.edu
2- Faculty of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran. ,
Abstract: (95 Views)
Soldering plays a crucial role in the electronics industry, driving the need for constant improvements in physical and mechanical properties and the management of intermetallic compound formation. Research in composite materials aims to achieve a uniform distribution of reinforcing particles within solder matrix to enhance their performance. This study investigates the integration of cobalt microparticles into SAC0307 lead-free soft solder alloy using the accumulative roll bonding (ARB) method. Microstructural analysis confirmed a homogeneous dispersion of cobalt particles within the solder after three ARB passes. Moreover, increasing cobalt content led to a reduction in the size of Cu6Sn5 intermetallic compounds, from 9 µm to 5 µm with 1% cobalt by weight. Examination of β-Sn grain morphology revealed the impact of cobalt particles on recovery and recrystallization kinetics in the solder. Mechanical testing indicated a 20% decrease in interlayer strength within composite solder sheets. Tensile tests showed a 28% increase in strength and a 31% decrease in elongation for composite solder alloy containing 1% cobalt. Differential scanning calorimetry (DSC) results revealed minimal change in the melting temperature of composite solder foil.
Keywords: Lead-free solders, Metal composites, Intermetallic compound, Microstructure, Accumulative Roll Bonding.
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