Volume 7, Issue 2 (Journal OF Welding Science and Technology 2022)                   JWSTI 2022, 7(2): 73-87 | Back to browse issues page

XML Persian Abstract Print

1- University of Bonab , b.binesh@ubonab.ac.ir
2- Sharif Branch of ACECR
3- Sahand University of Technology
Abstract:   (2621 Views)
Transient liquid phase (TLP) bonding of AISI 304L stainless steel was carried out using BNi-2 amorphous interlayer. The microstructure of the joint area was studied by using optical and scanning electron microscopes and energy dispersive spectroscopy. The effect of bonding temperature (1030-1110 °C) was studied on the microstructure and corrosion behavior of the TLP bonded samples. Electrochemical corrosion resistance of the bonded samples was evaluated in 3.5% NaCl solution at room temperature. The mechanism of the microstructure formation and the solidification sequence at the joint area were discussed. Ni- and Cr-rich borides, Ni-Si-B compound and fine Ni3Si particles were identified in the γ-Ni matrix at the joint centerline. The microstructural investigations revealed that the solidification sequence of these phases is: L→ γ + L → γ + Ni boride + Cr boride + L → γ + Ni boride + Cr boride + Ni-Si-B Compound. The highest corrosion resistance was observed in the sample bonded at 1070 °C for 30 min, which is comparable to that of the as-received AISI 304L stainless steel. It was attributed to the bond region microstructure with a negligible amount of eutectic constituents formed in the athermally solidified zone.
Full-Text [PDF 3444 kb]   (893 Downloads)    
Type of Study: Research | Subject: Special

Rights and permissions
Creative Commons License This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.